1750 Mitchell Ave. Oroville, CA 95966                    Phone: (530) 693-8267                    Email: dennis@pcb-repair.com

Convert your lead sphere BGA components back to lead spheres for military and other high reliability requirements. We offer BGA reballing training, and BGA reballing services. Specializing in solder ball removal, and solder ball attach. Using non-contact, no clean, and waterless methods.

With some of the issues that have come up using lead free solders, we have found that companies with military requirements are requesting that lead solder spheres be put back on to their BGA components.

This class will cover removing lead free solder balls using a non-contact method.  Various ball attach methods now available on the market.  Developing safe reflow profiles.  How to cope with sensitive solder masks that start to break down during the rework process.  How to repair damaged solder mask.  And consideration for components that are overly moisture sensitive, and require a no-clean process.

A one-day hands on class for only $350.00 per student.

Call (530) 534-1738 to make reservations.

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Last modified: July 13, 2010